Titanium thin film modified silica substrate to enhance the bonding properties of nanosilver

  • Lin, H.M. (Department of Material Engineering, Tatung University) ;
  • Liu, Y.T. (Department of Material Engineering, Tatung University) ;
  • Lin, K.N. (Department of Material Engineering, Tatung University) ;
  • Chang, W.S. (Department of Material Engineering, Tatung University) ;
  • Wu, C.Y. (Central Research Institute, Chunghwa Picture Tubes, Ltd.) ;
  • Liu, P.Y. (Central Research Institute, Chunghwa Picture Tubes, Ltd.)
  • Published : 2006.08.22

Abstract

Nanosilver has intrinsic problem to adhesion on the surface of silica. To improve interfacial properties between nanosilver and silica substrate, a thin titanium film is introduced in this study. The titaniumcoated silica substrates are prepared by sputter technique. The commercial silver nanopaste with size around 3-7nm is used in this study. The results indicate thin layer of titanium can improve the bonding properties of nanosilver and expect to be used in fabrication of TFT display panel.

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