한국정보디스플레이학회:학술대회논문집

한국정보디스플레이학회 (The Korean Infomation Display Society)
권호 표지

Development of new heat dissipated material in metal core PCB for LED backlight source

  • Ban, K.Y. (Information Display Research Center, Korea Electronics Technology Institute) ;
  • Lee, D.Y. (Information Display Research Center, Korea Electronics Technology Institute) ;
  • Lee, M.J. (Information Display Research Center, Korea Electronics Technology Institute) ;
  • Han, C.J. (Information Display Research Center, Korea Electronics Technology Institute) ;
  • Han, J.I. (Information Display Research Center, Korea Electronics Technology Institute)
  • 발행 : 2006.08.22
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초록

We report on carbon nano-fibers (CNFs) for applying to epoxy as a highly thermal conductive adhesive. In order to fabricate CNFs, electro-spinning process was performed with polyacrylonitrile (PAN) solutions. The sample was stabilized at the annealing temperature of $360^{\circ}C$, and carbonized from 900 to $1100^{\circ}C$. It is shown that the synthesized CNFs have a good thermal conductivity of several hundred W/m K. LED backlight units (BLUs) fabricated with MPCB using CNF-mixed epoxy give a better heat dissipation and higher performance than normal LED BLUs. On the basis of SEM, XRD, and FTIR, the characteristics of CNFs are described.

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