한국분말야금학회:학술대회논문집 (Proceedings of the Korean Powder Metallurgy Institute Conference)
- 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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- Pages.1251-1252
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- 2006
The Effect of Deformation Stress-strain and Temperature on the $I_c$ Degradation of Bi-2223/Ag Tapes
- Ha, Hong-Soo (Superconducting Materials Group) ;
- Kim, Sang-Cheol (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
- Ha, Dong-Woo (Superconducting Materials Group) ;
- Oh, Sang-Soo (Superconducting Materials Group) ;
- Joo, Jin-Ho (Nexans Korea Ltd.)
- 발행 : 2006.09.24
초록
In order to investigate 95% retained critical current of Bi-2223/Ag tapes under various stress-strain conditions, load cell attached tension and bending apparatus was used. The critical current of stress-strained tape was degraded below 95% retained critical current when tension and bending was simultaneously applied together. But only one of this tension or bending did not degrade the tape below 95% retained critical current. Deformation temperature was important to maintain the 95% retained Ic of Bi-2223/Ag tapes after bending or tension deformation because mechanical strength of tapes can be changed drastically between room temperature and 77 K.