The Effect of Deformation Stress-strain and Temperature on the $I_c$ Degradation of Bi-2223/Ag Tapes

In order to investigate 95% retained critical current of Bi-2223/Ag tapes under various stress-strain conditions, load cell attached tension and bending apparatus was used. The critical current of stress-strained tape was degraded below 95% retained critical current when tension and bending was simultaneously applied together. But only one of this tension or bending did not degrade the tape below 95% retained critical current. Deformation temperature was important to maintain the 95% retained Ic of Bi-2223/Ag tapes after bending or tension deformation because mechanical strength of tapes can be changed drastically between room temperature and 77 K.