Proceedings of the Korean Powder Metallurgy Institute Conference (한국분말야금학회:학술대회논문집)
- 2006.09b
- /
- Pages.915-915
- /
- 2006
Structural and Thermal Properties of Hot Pressed Cu/C Matrix Composite Materials Used for Thermal Management of High Power Electronic Devices
- Silvain, Jean-Francois (Ceramic and Metal Matrix Composite, Institut de chimie de la matiere condensee de Bordeaux) ;
- Soccart, Jacques (Research and development, Thermidrain SAS)
- Published : 2006.09.24
Abstract
Keywords