Thermal Dissipation Performance of a Heat Sink/Vapor Chamber Prepared by Metal Injection Molding Process

In this study, copper vapor chambers with built-in cooling fins, which eliminated the soldered or brazed joints in the conventional vapor chamber, were fabricated using the metal injection molding process. The results show that with optimized molding parameters, fins with an aspect ratio up to 18 could be produced. After sintering, the densities of the fin and chamber reached 96%. With only 32 cooling fins and a small fan installed, the thermal resistance of the heat sink was $1.156^{\circ}C/W$, and the power dissipation was 40W when the junction temperature was $70^{\circ}C$. When copper powder was sintered onto the chamber to make a vapor chamber, the thermal resistance decreased to $1.046^{\circ}C/W$.