Tungsten/Copper Functionally Graded Materials : Possible Applications and Processing through the Powder Metallurgy Route

  • Ozer, O. (INPG, Laboratoire de Thermodynamique et de Physico-Chimie Metallurgiques (LTPCM), UMR 5614 CNRS-INPG/UJF, Domaine Universitaire) ;
  • Missiaen, J.M. (INPG, Laboratoire de Thermodynamique et de Physico-Chimie Metallurgiques (LTPCM), UMR 5614 CNRS-INPG/UJF, Domaine Universitaire) ;
  • Pascal, C. (INPG, Laboratoire de Thermodynamique et de Physico-Chimie Metallurgiques (LTPCM), UMR 5614 CNRS-INPG/UJF, Domaine Universitaire) ;
  • Lay, S. (INPG, Laboratoire de Thermodynamique et de Physico-Chimie Metallurgiques (LTPCM), UMR 5614 CNRS-INPG/UJF, Domaine Universitaire) ;
  • Chaix, J.M. (INPG, Laboratoire de Thermodynamique et de Physico-Chimie Metallurgiques (LTPCM), UMR 5614 CNRS-INPG/UJF, Domaine Universitaire) ;
  • Mitteau, R. (CEA / DSM / DRFC / SIPP / CFP (Plasma Facing Components group), CEA Cadarache)
  • Published : 2006.09.24

Abstract

Processing of W-Cu graded materials from attritor-milled W-CuO mixtures is described. The powder reduction steps are investigated by TG and XRD analyses and by microstructural observations (SEM, TEM). Sintering of reduced powder with different compositions is analysed by dilatometry. Sintering behaviour of the graded component processed by co-compaction of a 10/20/30wt%Cu multi-layer material is briefly discussed. Liquid Cu migration is observed and smooths the composition gradient. Perspectives to control this migration are discussed.

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