대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 2006년도 추계학술대회 논문집 전기물성,응용부문
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- Pages.87-88
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- 2006
세리아 연마제 첨가량에 따른 산화막 CMP 특성 고찰
Improvement of Oxide-Mechanical Polishing Characteristics According to the Ceria Abrasive Adding
- Han, Sang-Jun (Daebul University) ;
- Park, Sung-Woo (Daebul University) ;
- Lee, Woo-Sun (Chosun University) ;
- Sea, Yong-Jin (Daebul University)
- 발행 : 2006.10.27
초록
To investigate the possibility of ceria abrasive-added slurry for the oxide-chemical mechanical polishing (oxide-CMP) application, two kinds of retreated methods were introduced as follows: First, the characteristics of mixed abrasive slurry (MAS) using
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