대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)

대한전기학회 (The Korean Institute of Electrical Engineers)
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MAS (Mixed Abrasive Slurry)가 Metal CMP에 미치는 영향

Effects of Mixed Abrasive Slurry(MAS) on Metal CMP Characteristics

  • 발행 : 2006.10.27
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초록

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, so as to investigate the influence of mixed abrasive slurry (MAS), such as $ZrO_2$, $CeO_2$, and $MnO_2$ for Ti-CMP application.

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