대한설비공학회:학술대회논문집 (Proceedings of the SAREK Conference)
- 대한설비공학회 2006년도 하계학술발표대회 논문집
- /
- Pages.779-785
- /
- 2006
정전효과를 고려한 반도체 웨이퍼의 입자침착 특성
Particle Deposition Characteristics with Electrostatic Effect on Semiconductor Wafers
- 발행 : 2006.06.21
초록
Particle transport and deposition characteristics on semiconductor wafers inside the chamber were experimentally investigated via a particle generation & deposition system and a wafer surface scanner. Especially the relation between particle size(