대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 2006년도 제37회 하계학술대회 논문집 B
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- Pages.741-742
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- 2006
YBCO 2G 선재간 접합 특성 연구
Charateristics analysis of the joining of YBCO 2G HTS wire
- 장기성 (연세대학교 전기전자공학과) ;
-
박동근
(연세대학교 전기전자공학과) ;
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양성은
(연세대학교 전기전자공학과) ;
- 안민철 (기초전력연구원) ;
- 조대호 (연세대학교 전기전자공학과) ;
- 김현규 (연세대학교 전기전자공학과) ;
- ;
-
고태국
(연세대학교 전기전자공학과)
- Chang, Ki-Sung (Dept. of Electrical and Electronic Engineering, Yonsei Univ.) ;
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Park, Dong-Keun
(Dept. of Electrical and Electronic Engineering, Yonsei Univ.) ;
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Yang, Seong-Eun
(Dept. of Electrical and Electronic Engineering, Yonsei Univ.) ;
- Ahn, Min-Cheol (Korea Electrical Engineering & Science Research Institute) ;
- Jo, Dae-Ho (Dept. of Electrical and Electronic Engineering, Yonsei Univ.) ;
- Kim, Hyoun-Kyu (Dept. of Electrical and Electronic Engineering, Yonsei Univ.) ;
- Lee, Hai-Gun (Dept. of Electrical and Electronic Engineering, Yonsei Univ.) ;
-
Ko, Tae-Kuk
(Dept. of Electrical and Electronic Engineering, Yonsei Univ.)
- 발행 : 2006.07.12
초록
This paper deals with an efficient superconducting joint method between 2G high superconducting(HTS) wire, YBCO coated conductor(CC). Recently CC is one of the most promising superconducting wire due to high n-value and critical current independency from external magnetic field. It is expected to be used many superconducting application such as fault current limiter, persistent current system and cable etc. In most HTS applications, superconducting magnet is used, and it is necessary to joint between superconducting wire to fabricate superconducting magnet system. A CC tape used in this research consists of copper stabilizer, silver layer, YBCO layer, buffer and substrate. Direct joint using soldering method was inefficient due to resistance of copper, then copper lamination is removed by chemical etching method to reduce resistance between CC tapes. Jointed tapes were fabricated and tested. Transport current through jointed area and induced voltage were measured to characterize the I-V curve. Resistance between CC wire using chemical etching was compared with resistance of direct jointed tapes using soldering method in this paper.
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