Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2006.07c
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- Pages.1450-1451
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- 2006
A Study on CMP Mechanism of $Bi_{3.25}La_{0.75}Ti_{3}O_{12}$ (BLT) Thin Films
$Bi_{3.25}La_{0.75}Ti_{3}O_{12}$ (BLT) 박막의 CMP 메커니즘 연구
- Shin, Sang-Hun (Dept. of Electrical Eng., Chosun University) ;
- Ko, Pil-Ju (Dept. of Electrical Eng., Chosun University) ;
- Kim, Nam-Hoon (Research Institute of Energy Resources Technology, Chosun University) ;
- Lee, Woo-Sun (Dept. of Electrical Eng., Chosun University)
- Published : 2006.07.12
Abstract
In this paper, we first applied the chemical mechanical polishing (CMP) process to the planarization of ferroelectric film in order to obtain a good planarity of electrode/ferroelectric film interface.
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