Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 2005.06a
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- Pages.393-395
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- 2005
Evaluation for Al/Cu bonding by liquefaction after solid phase diffusion in the air
- Kawakami, Hiroshi (Faculty of Engineering, Mie University) ;
- Suzuki, Jippei (Faculty of Engineering, Mie University) ;
- Fujiwara, Masanori (Graduate School of Mie University) ;
- Nakajima, Junya (Graduate School of Mie University) ;
- Kimura, Keiko (Graduate School of Mie University)
- Published : 2005.06.23
Abstract
The bonding for Aluminum and Copper in the air is investigated in this study. This bonding method does not include the special process of removing aluminum oxide films. In case of this bending, each metal Is heated at bonding temperature where is above eutectic temperature of Al-Cu system and below melting point of Aluminum. The liquefaction around the bonding surface occurs after the diffusion at solid state of each metal. This phenomenon is predicted by the temperature range above eutectic temperature of Al-Cu equilibrium phase diagram.
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