대한용접접합학회:학술대회논문집 (Proceedings of the KWS Conference)
- 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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- Pages.34-36
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- 2005
Characteristics of copper wire wedge bonding
- Tian, Y. (University of Waterloo) ;
- Zhou, Y. (University of Waterloo) ;
- Mayer, M. (University of Waterloo) ;
- Won, S.J. (MK Electronics) ;
- Lee, S.M. (MK Electronics) ;
- Cho, S.Y. (University of Seoul) ;
- Jung, J.P. (University of Seoul)
- 발행 : 2005.06.23
초록
Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with
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