대한용접접합학회:학술대회논문집 (Proceedings of the KWS Conference)
- 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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- Pages.25-27
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- 2005
Sn-Zn 무연솔더를 사용한 BGA패키지의 계면반응 및 신뢰성 평가
Reliability Investigation and Interfacial Reaction of BGA packages Using the Pb-free Sn-Zn Solder
- 발행 : 2005.06.23
초록
Sn-9Zn solder balls were bonded to Cu and ENIG (Electroless Nickel/Immersion Gold) pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were
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