대한전자공학회:학술대회논문집 (Proceedings of the IEEK Conference)
- 대한전자공학회 2005년도 추계종합학술대회
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- Pages.925-928
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- 2005
마이크로 머시닝 기술을 이용한 밀리미터파 대역 저 손실 결합기에 관한 연구
High performance couplers using micromachined transmission lines in millimeter-wave band
- 임병옥 (동국대학교 밀리미터파 신기술) ;
- 김성찬 (동국대학교 밀리미터파 신기술) ;
- 백태종 (동국대학교 밀리미터파 신기술) ;
- 신동훈 (동국대학교 밀리미터파 신기술) ;
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이진구
(동국대학교 밀리미터파 신기술)
- Lim, Byeong-Ok (Millimeter-wave Innovation technology research center, Dongguk university) ;
- Kim, Sung-Chan (Millimeter-wave Innovation technology research center, Dongguk university) ;
- Baek, Tae-Jong (Millimeter-wave Innovation technology research center, Dongguk university) ;
- Shin, Dong-Hoon (Millimeter-wave Innovation technology research center, Dongguk university) ;
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Rhee, Jin-Koo
(Millimeter-wave Innovation technology research center, Dongguk university)
- 발행 : 2005.11.26
초록
In this study, we fabricated the DAMLs using surface micromachining technology as well a low loss coupler for the millimeter-wave band applications using these DAMLs. The structure of DAML is that a signal line is supported on ground plane by dielectric posts. Therefore it has advantages about the loss characteristic and the stable structure. The other advantage of the DAML process is a simple and convenient technique using 4 mask steps, even if it has a micromachining technology. The lowest loss of the fabricated DAML was obtained 2.2 dB/cm at 110 GHz. To obtain the low loss characteristic, couplers were designed and fabricated by using DAMLs. The fabricated ring hybrid coupler has the coupling of 3.58 dB and the thru of 3.31 dB at 60 GHz. We can also obtain the coupling of 3.42 dB, the thru of 3.82 dB from fabricated branch line coupler at 60 GHz.
키워드