Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2005.07a
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- Pages.416-417
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- 2005
Surface Flatness Improvement in Si Anisotropy Etching Process Utilizing Ultrasonic Wave Technology
초음파 기술을 이용한 실리콘 이방성 식각 공정에서의 표면 평탄화 향상 연구
- Yun, Eui-Jung (Dept. of Information & Control Engin., Hoseo Univ.) ;
- Kim, Jwa-Yeon (Dept. of New Material Engin., Hoseo Univ.) ;
- Lee, Kang-Won (KITECH) ;
- Lee, Seok-Tae (KITECH)
- Published : 2005.07.07
Abstract
In this study, we optimized the process of Si anisotropy etching by combing tetramethyl ammonium hydroxide (TMAH) etching process with ultrasonic wave technology. New ultrasonic TMAH etching apparatus was developed and it was used for fabricating a