Vacuum 'brusher' for the alignment treatment of the large area LCD sub strates

  • Yaroshchuk, O.V. (Institute of Physics, NASU) ;
  • Liu, P.C. (Industrial Technology Research Institute) ;
  • Lee, C.D. (Industrial Technology Research Institute) ;
  • Lee, C.Y. (Industrial Technology Research Institute) ;
  • Kravchuk, R.M. (Institute of Physics, NASU) ;
  • Dobrovolskyy, A.M. (Institute of Physics, NASU) ;
  • Protsenko, I.M. (Institute of Physics, NASU) ;
  • Goncharov, A.A. (Institute of Physics, NASU) ;
  • Lavrentovich, O.D. (Liquid Crystal Institute and Chemical Physics Interdisciplinary Program, Kent State University)
  • Published : 2005.07.19

Abstract

We present an overview of our new method of liquid crystal (LC) alignment based on the anisotropic etching of the alignment layers with a directed plasma flux. The method is realized by the use of anode layer source of "race track" geometry generating two "sheets" of accelerated plasma. These sheets are directed obliquely to the treated substrates. The static and dynamic irradiation regimes have been explored. The optimized processing conditions and materials are discussed. The technique yields an excellent uniformity of liquid crystal alignment of planar, tilted and vertical types. It is shown that the new method can be easily adapted for the alignment treatment of large area substrates used in the modern LCD manufacturing process.

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