한국정밀공학회:학술대회논문집 (Proceedings of the Korean Society of Precision Engineering Conference)
- 한국정밀공학회 2005년도 춘계학술대회 논문집
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- Pages.81-85
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- 2005
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- 2005-8446(pISSN)
유전자 알고리듬 기반 다단계 최적설계 방법을 이용한 웨이퍼 단면 연삭기 구조물의 경량 고강성화 최적설계
Structural Design Optimization of a Wafer Grinding Machine for Lightweight and Minimum Compliance Using Genetic Algorithm
Abstract
In this paper, the structural design optimization of a wafer grinding machine using a multi-step optimization with genetic algorithm is presented. The design problem, in this study, is to find out the optimum configuration and dimensions of structural members which minimize the static compliance, the dynamic compliance, and the weight of the machine structure simultaneously under several design constraints. The first design step is shape optimization, in which the best structural configuration is found by getting rid of structural members that have no contributions to the design objectives from the given initial design configuration. The second and third steps are sizing optimization. The second design step gives a set of good design solutions having higher fitness for lightweight and minimum static compliance. Finally the best solution, which has minimum dynamic compliance and weight, is extracted among those good solution set. The proposed design optimization method was successfully applied to the structural design optimization of a high precision wafer grinding machine. After optimization, both static and dynamic compliances are reduced more than
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