한국소성가공학회:학술대회논문집 (Proceedings of the Korean Society for Technology of Plasticity Conference)

한국소성∙가공학회 (The Korean Society for Technology of Plasticity and materials processing)
권호 표지

Diamond-like carbon 코팅기술을 사용한 UV-임프린트 스탬프 제작

Fabrication of UV imprint stamp using diamond-like carbon coating technology

  • 정준호 (한국기계연구원 나노공정장비연구센터) ;
  • 김기돈 (한국기계연구원 나노공정장비연구센터) ;
  • 심영석 (한국기계연구원 나노공정장비연구센터) ;
  • 최대근 (한국기계연구원 나노공정장비연구센터) ;
  • 최준혁 (한국기계연구원 나노공정장비연구센터) ;
  • 이응숙 (한국기계연구원 나노공정장비연구센터) ;
  • 임태우 (한국과학기술원 기계공학과) ;
  • 박상후 (한국과학기술원 기계공학과) ;
  • 양동열 (한국과학기술원 기계공학과) ;
  • 차남구 (한양대학교 재료화공학) ;
  • 박진구 (한양대학교 재료화공학)
  • JEONG JUN-HO (Nano-Mechanical Systems Research Center, Korea Institute of Machinery and Materials) ;
  • KIM KI-DON (Nano-Mechanical Systems Research Center, Korea Institute of Machinery and Materials) ;
  • SIM YOUNG-SUK (Nano-Mechanical Systems Research Center, Korea Institute of Machinery and Materials) ;
  • CHOI DAE-GEUN (Nano-Mechanical Systems Research Center, Korea Institute of Machinery and Materials) ;
  • CHOI JUNHYUK (Nano-Mechanical Systems Research Center, Korea Institute of Machinery and Materials) ;
  • LEE EUNG-SUG (Nano-Mechanical Systems Research Center, Korea Institute of Machinery and Materials) ;
  • LIM TAE-WOO (Department of Mechanical Engineering, Korea Advanced Institute of Science & Technology) ;
  • PARK SANG-HU (Department of Mechanical Engineering, Korea Advanced Institute of Science & Technology) ;
  • YANG DONG-YOL (Department of Mechanical Engineering, Korea Advanced Institute of Science & Technology) ;
  • CHA NAM-GOO (Division of Materials and Chemical Engineering, Banyans University) ;
  • PARK JIN-GOO (Division of Materials and Chemical Engineering, Banyans University)
  • 발행 : 2005.10.01
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초록

The two-dimensional (2D) and three-dimensional (3D) diamond-like carbon (DLC) stamps for ultraviolet nanoimprint lithography (UV-NIL) were fabricated using two kinds of methods, which were a DLC coating process followed by the focused ion beam (FIB) lithography and the two-photon polymerization (TPP) patterning followed by nano-scale thick DLC coating. We fabricated 70 nm deep lines with a width of 100 nm and 70 nm deep lines with a width of 150 nm on 100 nm thick DLC layers coated on quartz substrates using the FIB lithography. 200 nm wide lines, 3D rings with a diameter of $1.35\;{\mu}m$ and a height of $1.97\;{\mu}m$, and a 3D cone with a bottom diameter of $2.88\;{\mu}m$ and a height of $1.97\;{\mu}m$ were successfully fabricated using the TPP patterning and DLC coating process. The wafers were successfully printed on an UV-NIL using the DLC stamp. We could see the excellent correlation between the dimensions of features of stamp and the corresponding imprinted features.

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