Etching characteristics of Ta and TaN using Cl2/Ar inductively coupled plasma

  • Shin, M.H. (Dept. of Materials Engineering and Center for Advanced Plasma Surface Technology Sungkyunkwan University) ;
  • Na, S.W. (Dept. of Materials Engineering and Center for Advanced Plasma Surface Technology Sungkyunkwan University) ;
  • Lee, N.E. (School of Materials science and Engineering, Hanyang University) ;
  • Ahn, J.H. (School of Materials science and Engineering, Hanyang University)
  • Published : 2004.08.19