파손확률 모델을 이용한 솔더 조인트의 건전성 평가

Reliability Estimation of Solder Joint by Using Failure Probability Model

  • 명노훈 (인하대학교 기계공학과 대학원) ;
  • 이억섭 (인하대학교 기계공학부) ;
  • 김동혁 (인하대학교 기계공학과 대학원)
  • 발행 : 2004.04.28

초록

Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and solder joint' failure. The first order Taylor series expansion of the limit state function incorporating with Tresca failure criterion is used in order to estimate the failure probability of solder joints under heated condition. Using shear stresses and shear strains appeared on the solder joint, we estimate the failure probability of solder joints with the Tresca failure criterion. The effects of random variables such as CTE, distance of the solder joint from the neutral point(DNP), temperature variation and height of solder on the failure probability of the solder joint are systematically studied by using the failure probability model with first order reliability method(FORM).

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