A study on the Reliability Assurance of the Electronic Equipment made with Lead-Free Solder - in the restriction of the use of hazardous substances -

유해물질 사용제한에 따라 무연솔더링 공정으로 생산된 전자제품의 신뢰성확보 방안

  • Song Byeong-Suk (Dept. of Industrial Engineering, Kyung Hee University) ;
  • Cho Jai-Rip (Dept. of Industrial Engineering, Kyung Hee University)
  • Published : 2004.04.01

Abstract

European Union Member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain mercury, cadmium, lead, hexavalent chromium, polybrominated biphenyls(PBB) or polybrominated diphenyl ethers(PBDE) (by Directive 2002/95/EC of The European Parliament and the Council of 27 january, 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment ). So, It is important to develop lead free solder and to assure the reliability of appliance. But lead free solder(i.e. Sn-3Ag-0.5Cu) have some problems such as lift off, whisker, migration and crack, etc. In this paper we discuss the reliability assurance method in lead free solder and appliance.

Keywords