Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference (한국펄프종이공학회:학술대회논문집)

2004.07a
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Pages.135-154
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2004

Korea Technical Association of the Pulp and Paper Industry (한국펄프종이공학회)

권호 표지

Investigation of Technical Interaction between Paper and Packaging

제지와 포장의 기술적 상용화 탐색

Shin, Jun-Seop (Yong-In Songdam College)

신준섭 (용인송담대학)

Published : 2004.07.01

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Abstract

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