Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference (한국윤활학회:학술대회논문집)

2004.11a
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Pages.330-330
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2004

Korean Tribology Society (한국트라이볼로지학회)

권호 표지

The effect of abrasive size on uniformity in CMP process

연마입자 크기가 CMP 공정의 연마균일도에 미치는 영향

Ahn Jin-Woo (Department Material Science and Engineering, Korea Univ.) ;
Cho Byun-Gjick (Department Material Science and Engineering, Korea Univ.) ;
Lim Dae-Soon (Department Material Science and Engineering, Korea Univ.) ;
Park Hyung-Soon (Memory Research & Development Division, Hynix Semiconductor Inc.) ;
Shin Jong-Han (Memory Research & Development Division, Hynix Semiconductor Inc.)

안진우 (고려대학교) ;
조병직 (고려대학교) ;
임대순 (고려대학교) ;
박형순 ((주)하이닉스반도체) ;
신종한 ((주)하이닉스반도체)

Published : 2004.11.01

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