Correction Coeffecient for Tensile Adhesive Strength of the Bridge Decks Waterproofing Systems with Different Temperature Conditions

온도조건에 따른 교면방수재의 인장접착강도 보정계수에 관한 실험적 연구

  • 이병덕 (한국도로공사 도로교통기술원) ;
  • 윤병성 (한국도로공사 도로교통기술원)
  • Published : 2004.05.01

Abstract

In this study, tensile adhesive strength(TAS) test was carreid out for evaluated the effects of temperature conditions (-20, -10, 0, 5, 10, 20, 30, $40^{\circ}C$) on the tensile adhesive characteristics about 4 type waterproofing membranes which were commercially used in bridge decks. And, failure appeariences of waterproofing systems in each temperature after TAS test were observed the sawing surfaces of waterproofing systems for whether or not damaged of waterproofing membranes. Also, correction coefficient of TAS with temperature were calculated using 4 type waterproofing membrane. It could be shown that the higher TAS and shear adhesive strength, the lower temperature, regardless of the type of waterproofing membrane. Temperature sensibility of TAS was especially remarkable in epoxy membrane. Failure type was occurred the ductile failure in $30^{\circ}C\;and\;40^{\circ}C$. From these results, it was shown that if ambient temperature above $30^{\circ}C$ maintains for a long time, waterproofing membrane will be deformed by softening. Otherwise, waterproofing membrane in temperature below $20^{\circ}C$ shown that occurred the brittle failure. From the results of visual observation of cutting surface for specimen, the thin waterproofing membranes shown indented by hot aggregate of the asphalt mixtures. Therefore, it could be known that the specification of waterproofing membrane thickness is necessary by waterproofing membrane type. As temperature change varied with pavement depth, the interface temperature was more important than ambient temperature in TAS test. Now, TAS test results were limited only in $-10^{\circ}C\;and\;20^{\circ}C$ temperature, but correction coefficient of TAS by ambient temperature could be used as a solution to deal with this problem.

Keywords