Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.11a
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- Pages.69-69
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- 2004
( Bump Fabrication of chip on Glass Bonding Using Non - Conductive Adhesive )
NCA를 이용한 COG 본딩용 범프형성 공정
Abstract
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