Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.11a
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- Pages.52-52
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- 2004
(Relation between Electrical Resistance and Microstructure of Heat Treated Sn-3.5Ag Solder Bumps)
열처리에 따른 Sn-3.5Ag 솔더 범프의 전기저항 변화와 미세구조와의 관계
Abstract
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