Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.11a
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- Pages.31-31
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- 2004
(Microstructural and Electrical Properties of Cu(Mg) Thin Films for ULSI Interconnects)
고집적 반도체 배선용 합금구리박막의 미세구조 및 전기적 특성 평가
Abstract
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