Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.11a
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- Pages.6-6
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- 2004
(Study on Mechanical Reliability of Poly-Imide Passivation in Microelectronics Packaging)
반도체 package용 PI passivaton의 기계적 물성 연구
Abstract
Keywords