대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 2004년도 하계학술대회 논문집 C
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- Pages.1727-1729
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- 2004
$WO_3$ Thin Film의 CMP 특성
Characteristic of $WO_3$ Thin Film CMP
- 발행 : 2004.07.14
초록
Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP precess, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). we investigated the performance of
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