The Distribution of Temperature on Pad Surface During CMP Process

CMP 공정중 패드 표면의 온도분포에 관한 연구

  • 정영석 (부산대 대학원 정밀기계공학과) ;
  • 김형재 (부산대 대학원 정밀기계공학과) ;
  • 정해도 (부산대학교 기계공학부)
  • Published : 2003.04.23

Abstract

The friction heat generated by the CMP process hasinfluence on removal rate and WIWNU(Within Wafer Non-Uniformity). Therefore, the object of this study is to find the distribution of temperature on pad surface during CMP process. To do this, the authors analyse the kinematics of CMP equipment to verify the sources of friction heat and compare the analysis result with the experimental results. Through the analysis and experiment conducted in this paper, we can predict the distribution of polishing temperature across the pad surface. Furthermore the result could help to predict the process conditions which could enhance the polishing results, such as WIWNU and removal rate of thin film to achieve more efficient process.

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