대한기계학회:학술대회논문집 (Proceedings of the KSME Conference)
- 대한기계학회 2003년도 추계학술대회
- /
- Pages.145-150
- /
- 2003
MCCB 내의 온도장에 대한 수치적 연구
A Numerical Study on Temperature Fields in MCCB
- 발행 : 2003.11.05
초록
In this paper we have studied the characteristics of temperature fields in a Molded Case Circuit Breaker (MCCB). A switch and a trip device are arranged in narrow space of the MCCB. Thus, thermal factors have been risen to important problem. The temperature rise means an energy loss and it becomes the reason of fatal fault in devices. Also, the temperature rise on the connection and the contact parts is regulated up to
키워드