A Numerical Study on Temperature Fields in MCCB

MCCB 내의 온도장에 대한 수치적 연구

In this paper we have studied the characteristics of temperature fields in a Molded Case Circuit Breaker (MCCB). A switch and a trip device are arranged in narrow space of the MCCB. Thus, thermal factors have been risen to important problem. The temperature rise means an energy loss and it becomes the reason of fatal fault in devices. Also, the temperature rise on the connection and the contact parts is regulated up to $115^{\circ}C$ and $105^{\circ}C$, respectively. Therefore, a study for preventing the temperature rise should be investigated. A numerical analysis method that has confidence might be preceded for this purpose. In order to verify the confidence of temperature field analysis, the results of the numerical analysis are compared with those of experimental one for the same model. Comparison results show a qualitatively good agreement within ${\pm}5%$ errors.