제어로봇시스템학회:학술대회논문집
- 2003.10a
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- Pages.2187-2191
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- 2003
A High-performance X/Y-axis Microaccelerometer Fabricated on SOI Wafer without Footing Using the Sacrificial Bulk Micromachining (SBM) Process
- Ko, Hyoung-Ho (New Jersey Microsystem, Inc.) ;
- Kim, Jong-Pal (New Jersey Microsystem, Inc.) ;
- Park, Sang-Jun (New Jersey Microsystem, Inc.) ;
- Kwak, Dong-Hun (New Jersey Microsystem, Inc.) ;
- Song, Tae-Yong (New Jersey Microsystem, Inc.) ;
- Setaidi, Dadi (New Jersey Microsystem, Inc.) ;
- Carr, William (New Jersey Microsystem, Inc.) ;
- Buss, James (Office of Naval Research) ;
- Dan Cho, Dong-Il (School of Electrical Engineering and Computer Science, Seoul National University)
- Published : 2003.10.22
Abstract
In this paper, a x/y-axis accelerometer is fabricated, using the SBM process on a <111> SOI wafer. This fabrication method solves the problem of the footing phenomenon in the conventional SOI process for improved manufacturability and performance. The roughened lower parts as well as the loose silicon fragments due to the footing phenomenon are removed by the alkaline lateral etching step of the SBM process. The fabricated accelerometer has a demodulated signal-to-noise ratio of 92 dB, when 40Hz, 5 g input acceleration is applied. The noise equivalent input acceleration resolution and bandwidth are