한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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- Pages.204-207
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- 2003
광모듈 솔더 접합부의 시효 특성에 관한 연구
Aging Characteristics of Solder bump Joint for High Reliability Optical module
- Kim, Nam-Kyu (ChungAng Uni.) ;
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Kim, Kyung-Seob
(YeoJoo Uni.) ;
- Kim, Nam-Hoon (ChungAng Uni.) ;
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Chang, Eui-Goo
(ChungAng Uni.)
- 발행 : 2003.05.16
초록
The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet to tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of sample was conducted. A TiW/Cu UBM structure was adopted and sample was aging treated to analyze the effect of intermetallic compound with time variation. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the fine joint area was observed by using SEM, TEM and EDS. In result, the shear strength was decreased of about 20% in the