Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2003.11a
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- Pages.473-476
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- 2003
The Influence of Encapsulation Layer Incorporated into Flexible Substrates for Bending Stress
Flexible 기판의 Bending Stress에 대한 Encapsulation Layer의 영향
- Park, Jun-Baek (Yonsei Univ.) ;
- Seo, Dae-Shik (Yonsei Univ.) ;
- Lee, Sang-Keuk (Kwangwoon Univ.) ;
- Lee, Joon-Ung (Kwangwoon Univ.) ;
- Kim, Yong-Hoon (Information Display Research Center, KETI) ;
- Moon, Dae-Gyu (Information Display Research Center, KETI) ;
- Han, Jeong-In (Information Display Research Center, KETI)
- 박준백 (연세대학교 전기전자공학과) ;
- 서대식 (연세대학교 전기전자공학과) ;
- 이상극 (광운대학교 전기전자공학과) ;
- 이준웅 (광운대학교 전기전자공학과) ;
- 김영훈 (전자부품연구원 디스플레이연구센터) ;
- 문대규 (전자부품연구원 디스플레이연구센터) ;
- 한정인 (전자부품연구원 디스플레이연구센터)
- Published : 2003.11.13
Abstract
This paper shows necessity of encapsulation layer to maximite flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer have an significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that have a significant effect on internal thermal stress. To compare magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.