대기압 플라즈마를 이용한 감광제 제거 공정과 damage에 관한 연구

A Study on Photoresist Stripping and Damage Using Atmospheric Pressure Plasma

  • 황인욱 (인하대학교 정보통신공학과 m-Parc) ;
  • 양승국 (인하대학교 정보통신공학과 m-Parc) ;
  • 송호영 (인하대학교 정보통신공학과 m-Parc) ;
  • 박세근 (인하대학교 정보통신공학과 m-Parc) ;
  • 오범환 (인하대학교 정보통신공학과 m-Parc) ;
  • 이승걸 (인하대학교 정보통신공학과 m-Parc) ;
  • 이일항 (인하대학교 정보통신공학과 m-Parc)
  • Hwang, In-Uk (Department of Information and Communication Engineering, m-Parc, Inha University) ;
  • Yang, Seung-Kook (Department of Information and Communication Engineering, m-Parc, Inha University) ;
  • Song, Ho-Young (Department of Information and Communication Engineering, m-Parc, Inha University) ;
  • Park, Se-Geun (Department of Information and Communication Engineering, m-Parc, Inha University) ;
  • O, Beom-Hoan (Department of Information and Communication Engineering, m-Parc, Inha University) ;
  • Lee, Seung-Gol (Department of Information and Communication Engineering, m-Parc, Inha University) ;
  • Lee, El-Hang (Department of Information and Communication Engineering, m-Parc, Inha University)
  • 발행 : 2003.11.13

초록

Ashing of photoresist was investigated in dielectric barrier discharges in atmospheric pressure by changing applied voltage, frequency, flow rate. we analyzed the plasma by Optical Emission Spectroscopy(OES) to monitor the variation of active oxygen species. Another new peaks of oxygen radical is observed by addition of argon gas. This may explain the increase in ashing rate with argon addition. With the results of Optical Emission Spectroscopy(OES), we can find the optimized ashing conditions. MIS capacitor for monitoring charging damage by the plasma was also studied. The results suggest the dielectric barrier discharges(DBD) can be an efficient, alternative Plasma source for general surface processing.

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