Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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Fabrication of Copper Electrode Array and Test of Electrochemical Discharge Machining for Glass Drilling

유리의 미세 구멍 가공을 위한 구리 전극군 제작 및 전기 화학 방전 가공 시험

  • Jung, Ju-Myoung (Division of Electrical & Computer Engineering, Ajou University) ;
  • Sim, Woo-Young (Division of Electrical & Computer Engineering, Ajou University) ;
  • Jeong, Ok-Chan (Division of Electrical & Computer Engineering, Ajou University) ;
  • Yang, Sang-Sik (Division of Electrical & Computer Engineering, Ajou University)
  • Published : 2003.10.31
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Abstract

In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining for the fabrication of microholes on Borofloat33 glass. Copper electrode array is fabricated by the bonding of silicon upper substrate and lower substrate and copper electroplate. The silicon upper electrode having microholes fabricated by ICP-RIE is the mold of copper electroplate. The lower substrate is used as the seed layer for copper electroplate after Au - Au thermocompression bonding with the upper substrate.

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