Study on the Structural and Thermal Properties of Modified Elastic Epoxy with Brittleness

취성 개량형 탄성에폭시의 구조 및 열적특성에 관한 연구

  • 이경용 (원광대학교 전기전자 및 정보공학부) ;
  • 이관우 (원광대학교 전기전자 및 정보공학부) ;
  • 민지영 (원광대학교 전기전자 및 정보공학부) ;
  • 최용성 (원광대학교 전기전자 및 정보공학부) ;
  • 박대희 (원광대학교 전기전자 및 정보공학부)
  • Published : 2003.10.31

Abstract

As toughness-investigation to improve brittleness of existing epoxy resin, elastic-factor of elastic epoxy using TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis) and FESEM (Field Emission Scanning Electron Microsope) for structure-images analysis were investigated. A range of measurement temperature of the TMA, DMTA was changed from -20[$^{\circ}C$] to 200[$^{\circ}C$]. When modifier was ratio of 0[phr], 20[phr], 35[phr], glass transition temperature (Tg) of elastic epoxy was measured through thermal analysis devices. Also, it was investigated thermal expansion coefficient ($\alpha$), modulus and loss factor through DMTA. In addition, it was analyzed structure through FSSEM and made sure elastic-factor of elastic epoxy visually. As thermal analysis results, 20[phr] was superior than 30[phr] thermally and mechanically. Specially, thermal expansion coefficient, modulus, damping properties were excellent. By structure-images analysis through FESEM, we found elastic-factor of elastic epoxy that is not existing epoxy, and proved high impact.

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