Proceedings of the Computational Structural Engineering Institute Conference (한국전산구조공학회:학술대회논문집)
- 2003.10a
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- Pages.389-394
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- 2003
Analysis of Thermal Stresses in Polymeric Thin Film
고분자 박막에서의 열응력 해석
Abstract
In this study, the stress singularity factors generated during cooling down from high curing temperature to room temperature have been analyzed for the viscoelastic thin film. The time domain boundary element method has been employed to investigate the behavior of stresses for the whole interface. Within the context of a linear viscoelastic theory, a stress singularity exists at the point where the interface between the elastic substrate and the viscoelastic thin film intersects the free surface.
Keywords