Low Cost and High Reliable Optical Package Using One Aspherical Lens Mounted on SiOB by Passive Alignment

SiOB위에 수동정렬된 비구면 렌즈를 사용한 저가형 고신뢰성 광패키징

  • 김유식 (삼성전자 통신연구소 광부품 Lab.) ;
  • 박문규 (삼성전자 통신연구소 광부품 Lab) ;
  • 장동훈 (삼성전자 통신연구소 광부품 Lab) ;
  • 김태일 (삼성전자 통신연구소 광부품 Lab.)
  • Published : 2003.02.01

Abstract

As the demand for high frequency(bandwidth) optical module of reduced cost is increased, there are considerable needs for low cost/ high reliable optical packaging method. In order to meet these requirements, the researches using silicon optical bench(SiOB) technology have been developed as one of the leading technology. In this paper, we discuss optical package using one aspherical lens mounted on SiOB by passive alignment, and present the reliability data for the optical module, which are temperature cycling between 40C and +85C, and high temperature storage 85C(unbiased), 2000hour.

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