Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)
- 2003.07e
- /
- Pages.2375-2378
- /
- 2003
3D Inspection of Printed Circuit Boards
PCB의 3차원 검사
Abstract
In manufacture of printed circuit boards, one important issue is precisely to measure the three-dimensional shape of the solder paste silk-screened prior to direct surface mounting of chips. This paper presents the 3D shape reconstruction of solder paste using the optical triangulation method based on structured light or slit beam and the measurement algorithm for height, volume. area, and coplanarity on component pads from the 3D range image. Futhermore, statistical process control function is incorporated for process capability analysis.
Keywords