Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)
- 2003.07b
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- Pages.1089-1092
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- 2003
Semiconductor Wafer Cleaning and PR Strip Processes using Ozone
오존을 이용한 반도체 웨이퍼 세정 및 PR 제거 공정
Abstract
This paper has been studied on wafer cleaning and photoresist striping in semiconductor fabrication processes using ozone solved deionized water. In this work, we have developed high concentration ozone generating system and high contact ratio ozone solving system to get high efficiency DIO
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