Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2003.09a
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- Pages.217-249
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- 2003
Unique New Packaging Technology of Semiconductor by High Performance Encapsulation Epoxy Resin and VPES(Vacuum Printing Encapsulation Systems)
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