Proceedings of the Korean Society of Machine Tool Engineers Conference (한국공작기계학회:학술대회논문집)
- 2003.04a
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- Pages.422-427
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- 2003
A Study on the Characteristics of Ultra-Precision Grinding far Sapphires
사파이어의 초정밀 연삭 특성 연구
Abstract
Sapphire have been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing Process.