Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2003.11a
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- Pages.239-242
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- 2003
Fabrication and Characterization of Window Metallization Pattern for Optical Module Package
광모듈 패키지용 Window 의 Metallization Pattern 제작 및 특성 평가
- Published : 2003.11.01
Abstract
Optical module package is a hermetic metal-ceramic package for carrying optical IC. In case of LD(laser diode) module, window is used for both the path of optical signal and hermetic sealing of package. So, window has the metallization pattern on the surface for brazing process with package wall. In this study, several method were investigated for metallization. Thin film, thick film and mixed method were used for fabrication of metallization pattern. After brazing process, hermeticity and adhesion strength were tested for characterization of metallization pattern.
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