Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2003.11a
- /
- Pages.156-156
- /
- 2003
Comparative Study of Thermally Conductive Fillers in Underfills
전자패키징용 언더필재료를 위한 열전도성 필러의 비교연구
Abstract
Keywords