Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2003.11a
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- Pages.133-137
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- 2003
Growth Behavior of Intermetallic Compounds in Sn-Ag-Bi/Cu Solder Joints during Aging
Sn-Ag-Bi/Cu 솔더 조인트의 aging시 금속간화합물 성장 거동
- Published : 2003.11.01
Abstract
The effect of Bi additions to the eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compound (IMC) layers during solid-state aging of Sn-Ag-Bi/Cu solder joints has been Investigated. The Bi additions enhanced the growth rate of the total IMC layer comprising of
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