Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

2003.11a
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Pages.27-27
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2003

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)

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Mechanical tenacity analysis of moisture barrier bag for semiconductor package

반도체 package 총 Moisture barrier bag의 기계적 물성 연구

KIM KeunSoo (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.) ;
KIM TaeSeong (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.) ;
YOO Min (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.) ;
YOO HeeYeoul (Material & Process Development Team, R&D center, Amkor Technology Korea, Inc.)

Published : 2003.11.01

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